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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2021-04-12 07:39:11
Creation time: 2016-02-28 18:51:20
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ID Name Designator Footprint Quantity
1 1k R1,R2,R3,R5,R4,R7,R8,R6,R9,R10,R12,R13,R14,R15 R3 14
2 BC337 Q1,Q2 SOT23 2
3 LED D1,D2 LED3MM 2
4 1u C1,C2,C3,C4,C5,C6,C7,C8 C1 8
5 -LM555 U2 DIL08 1
6 5Z6 D3 SOT23 1
7 10k R11 TRIM_POT_PTH 1
8 1N4848 D4,D5 DO35-7 2
9 PMOS_D / IRFP150N Q3 TO-3 1
10 0.33 R16 R3 1
11 12 V1 BATTERY 1
12 SPST_ON S1 TACTILE-PTH 1
13 1N5483 D6 DO35-7 1
14 LM7805EE U1 TO220 1
15 555 U20 DIP08 1
16 10k R100,R110 R3 2
17 100 R120 R3 1
18 TIP41A Q11 TO-3 1
19 TIP42A Q12 TO-3 1
20 2200U C400 CP_8X13MM 1
21 Mutual_Inductors T1 SOP-10 1
22 100U C300 CP_8X13MM 1
23 100N C100 CP_8X13MM 1
24 10N C200 CP_8X13MM 1

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