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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD ClassD_Svendeprøve_Udgang

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Update time: 2019-06-19 10:47:43
Creation time: 2019-03-12 10:41:41
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ID Name Designator Footprint Quantity
1 HIP4081AIBZT U1,U2 SOIC-20_300MIL 2
2 IRFB4019PBF Q1,Q2,Q3,Q4,Q5,Q6,Q7,Q8 TO-220(TO-220-3) 8
3 10 R1,R2,R3,R4,R7,R8,R9,R10 1206 8
4 220uF C1,C2,C9,C10 CAP-12.5*13.5 4
5 100n C3,C4,C11,C12 1206 4
6 1N4148W-13-F D1,D2,D3,D4 SOD-123 4
7 100n C5,C6,C13,C14 0805 4
8 100k R5,R6,R11,R12 1206 4
9 10uH L1,L2,L3,L4 1265 4
10 1uF C7,C8,C15,C16,C17 2220 5
11 Screw Terminal J1,J2,J3 H2-5.0-10.5X8.0MM 3
12 R-78HB12-0.5 U3 R-78HB12-0.5 1
13 4.7uF C18 1206 1
14 Header-Male-2.54_1x1 P1,P2 HDR-1X1/2.54 2
15 Header-Male-2.54_1x6 P3 HDR-6X1/2.54 1

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