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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
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1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
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Update time：
2020-03-21 20:38:22
Creation time：
2020-02-10 10:11:25
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| ID | Name | Designator | Footprint | Quantity | BOM_Manufacturer Part |
|---|---|---|---|---|---|
| 1 | 1N4007 | D1,D3,D4,D6,D2,D7,D5 | DO-41_BD2.4-L4.7-P8.70-D0.9-RD | 7 | 1N4007 |
| 2 | 0.01 мкФ | C5,C6,C4 | К10-17Б_ИМП._820ПФ_NPO,5%,0805,_КОНДЕНСАТОР_КЕРАМИЧЕСКИЙ_ВЫВОДНОЙ | 3 | К10-17Б имп. 820пФ NPO,5%,0805, Конденсатор керамический выводной |
| 3 | 2N5551 | Q1,Q2,Q3,Q5 | TO-92-3_L4.8-W3.7-P2.54-L | 4 | 2N5551-TA |
| 4 | 10 кОм | R2,R6,R8,R11,R12,R13,R1,R5,R14 | RES-TH_BD2.3-L6.5-P10.50-D0.5 | 9 | - |
| 5 | 2N5401 | Q4,Q6 | TO-92-3_L4.9-W3.7-P2.54-L | 2 | 2N5401 |
| 6 | L78L05ABZ-TR | U4 | TO-92-3_L4.8-W3.7-P2.54-L | 1 | L78L05ABZ-TR |
| 7 | 4.7 кОм | R3,R7,R9,R10,R4,R15 | RES-TH_BD2.2-L6.5-P10.50-D0.6 | 6 | - |
| 8 | PIC12F629-I/P | U3 | DIP-8_L10.1-W6.3-P2.54-LS7.6-BL | 1 | PIC12F629-I/P |
| 9 | 10мкФ 25В | C1 | ECAP_(К50-35),_10_МКФ_63В | 1 | k50-35 |
| 10 | 0.1 мкФ | C3,C2 | К10-17Б ИМП. 0.1 МКФ X7R,10%,1206, 100В, RDER72A104K, КОНДЕНСАТОР КЕРАМИЧЕСКИЙ ВЫВОДНОЙ | 2 | К10-17Б имп. 0.1 мкФ X7R,10%,1206, 100В, RDER72A104K |
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