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STD LM13700 test jigs

License: Public Domain

Mode: Editors' pick

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Update time: 2021-03-30 14:24:48
Creation time: 2017-03-16 10:28:04
Description
Some simple test jigs from the TI datasheet for the LM13700. The EasyEDA spice symbols LM13700_TI.1 and LM13700_TI.2 both use the original National Semiconductor subckt (now hosted by TI) but the pin connections of each symnbol are mapped onto each of the two devices in the 16 pin DIP (or SOIC) package. Product page: http://www.ti.com/product/LM13700 Datasheet: http://www.ti.com/lit/ds/symlink/lm13700.pdf Spice model: http://www.ti.com/lit/zip/snom267 Note however, that the TI subckt does not model the distortion of the input stage as the differential input voltage swing increases! For background information on the OTA that forms the core of the LM13700, search for: ca3080-a.pdf an6668.pdf
Design Drawing
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ID Name Designator Footprint Quantity
1 PULSE(-1V 1V 0s 1us 1us 499us 1ms) AC 1 0 VIN 2P-5.0 1
2 15V VPOS,VNEG 2P-5.0 2
3 10k RIN,R4,R10,RA NONE 4
4 5.1k R2,R4 NONE 2
5 PULSE(1.5V 2.5V 0s 15ms 1us 1ps 15ms) V_AMP_BIAS 2P-5.0 1
6 15k R_ABIAS NONE 1
7 800p C1,C2 RAD-0.1 2
8 1k R1,R3,R8,R9 NONE 4
9 20k R5,R6,R7 NONE 3
10 V=V(SWEEP,VEE) B1 NONE 1
11 LM13700_DS U1,U2,U3 PDIP16 3
12 SIN(0 10 1k) AC 1 0 VIN 2P-5.0 1
13 15 VPOS,VNEG 2P-5.0 2
14 SIN(1 14.5 50) V_AMP_BIAS 2P-5.0 1
15 30k R1,R_ABIAS,R_DBIAS,RIN NONE 4
16 5k R2 NONE 1
17 1K RTRIM RES-ADJ_3386P 1
18 100m VIN 2P-5.0 1
19 5 V_AMP_BIAS 2P-5.0 1
20 100k RR1,RR2,R12,R13 NONE 4
21 V=-V(INP) B1 NONE 1
22 V=-V(RP,RN)/I(VIN) B2 NONE 1

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