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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD TCCJoapPauloMetheusEduardoII

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Update time: 2021-08-24 08:54:03
Creation time: 2018-09-06 19:13:22
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ID Name Designator Footprint Quantity
1 0.1u C1,C5,C6,C7,C22,C40,C41 0603 7
2 15p C2,C3 0603 2
3 1uF C4 0805 1
4 33n C8,C9,C10,C11,C12,C13,C14,C15,C16,C17,C18,C19,C20,C21 0603 14
5 22uF(226) C23,C33 0805 2
6 4.7uF C24,C28 0805 2
7 10uF C26,C27 0805 2
8 220uF C29 CAP-D10.0XH10.5 1
9 22uF(226) C30 1206 1
10 100nF C31 0603 1
11 XH-2AW CN1 XH-2AW 1
12 1N4004F D4 SMAF 1
13 SMBJ33CA-E3/52 D5 SMB(DO-214AA) 1
14 BK250-030 F1,F2,F3 F-0.12A-250V 3
15 Header-Male-2.54_1x3 JP1 HDR-3X1/2.54 1
16 ACM4520-901-2P-t000 L1 ACM4520 1
17 60Ω L2,L3,L4,L5,L9 0805 5
18 ME6211C33M5G-N LDO1 SOT-23-5 1
19 17-21SUYC/TR8 LED2 LED-0805 1
20 Header-Male-2.54_2x2 P1,P2,P3,P4,P5,P6 HDR-2X2/2.54 6
21 WJ300V-5.0-2P P7,P10,P11,P12,P13,P14,P17,P18 WJ300V-5.00-2P 8
22 Header-Male-2.54_1x1 P8,P15,P16,P19,P20,P21,P22,P23,P24 HDR-1X1/2.54 9
23 FPC 0.5MM 6P Pull type H2.0mm Pick up P9 FPC-0.5MM-LSSJ-H2.0-6P 1
24 L2N7002KLT1G Q1 SOT-23-3 1
25 0R R1,R2,R5,R26,R27,R28,R45 0603 7
26 10k R3,R4,R42 0603 3
27 510k R6 0603 1
28 49.9 R7,R8,R11,R12,R15,R16 0603 6
29 1.2k R9,R10,R13,R14,R17,R18,R32,R33,R36,R37,R41,R43,R53,R54 0603 14
30 100k R19,R20,R21,R22,R29,R39 0603 6
31 14D361K R23,R24,R25 RES-16.5*5.2-7.5MM 3
32 24.9 R30,R31,R34,R35,R38,R40,R51,R52 0603 8
33 ATT7022EU U1 LQFP-44_10X10X08P 1
34 zmpt101b print U2,U3,U4 ZMPT101B PRINT 3
35 SE8117T50HF U7 SOT-223 1
36 5.5296MHz X1 OSC-49OSC-YSX-1 1

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