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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD MCP4725 Breakout v14

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Mode: Editors' pick

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Update time: 2021-04-11 12:19:09
Creation time: 2016-01-25 03:25:47
Description
MCP4725
Design Drawing
schematic diagram
1 /
PCB
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ID Name Designator Footprint Quantity
1 LOGO-SFE GND SFE-LOGO-FLAME 1
2 0.1uF C1 0603-CAP 1
3 4.7k R1,R2 0603-RES 2
4 DAC_MCP4725 U1 SOT23-6-MCP4725 1
5 STAND-OFF STANDOFF1,STANDOFF2 STAND-OFF 2
6 FRAME-LETTER FRAME2 CREATIVE_COMMONS 1
7 OSHW-LOGO LOGO1 OSHW-LOGO-S 1
8 M04 JP5 1X04 1
9 M02 JP6 1X02 1
10 JUMPER-PAD-3-NC_BY_TRACE SJ1 PAD-JUMPER-3-3OF3_NC_BY_TRACE_YES_SILK_FULL_BOX 1
11 JUMPER-PAD-3-2OF3_NC_BY_PASTE SJ2 PAD-JUMPER-3-2OF3_NC_BY_PASTE_YES_SILK_FULL_BOX 1
12 10k R3 0603-RES 1
13 FIDUCIAL FID1,FID2 FIDUCIAL-1X2 2

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