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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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STD MicroSD_Shield_v14
Mode: Editors' pick
- 0
Update time：
2016-01-26 03:30:33
Creation time：
2016-01-25 03:37:58
Description
MicroSD_Shield_v14
Design Drawing
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | FRAME-LETTER | FRAME1 | CREATIVE_COMMONS | 1 |
| 2 | SFE_LOGO_NAME_FLAME | JP1 | SFE_LOGO_NAME_FLAME_.1 | 1 |
| 3 | ARDUINO_R3_SHIELDNOLABELS | U2 | UNO_R3_SHIELD_NOLABELS | 1 |
| 4 | USD-SOCKET | U1 | MICRO-SD-SOCKET-PP | 1 |
| 5 | TAC_SWITCH | S1 | TACTILE_SWITCH_SMD | 1 |
| 6 | Red | LED1 | LED-0603 | 1 |
| 7 | 1k | R1 | 0603-RES | 1 |
| 8 | M08 | JP4,JP7 | 1X08 | 2 |
| 9 | M10 | JP5 | 1X10 | 1 |
| 10 | M06 | JP6 | 1X06 | 1 |
| 11 | HEX_CONVERTER | U3 | SO016 | 1 |
| 12 | FIDUCIAL | JP2,JP3 | FIDUCIAL-1X2 | 2 |
| 13 | REVISION | U$1 | REVISION | 1 |
| 14 | OSHW-LOGO | LOGO1 | OSHW-LOGO-M | 1 |
| 15 | SOLDERJUMPER | SJ1,SJ2 | SJ_2S | 2 |
| 16 | AVR_SPI_PRG_6 | J1 | 2X3-NS | 1 |
| 17 | 0.1uF | C1,C2 | 0603-CAP | 2 |
| 18 | 10uF | C3 | 0603-CAP | 1 |
| 19 | SFE_LOGO_FLAME.6_INCH | LOGO2 | SFE_LOGO_FLAME_.6 | 1 |
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