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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2023-02-01 15:52:32
Creation time: 2019-10-19 17:22:10
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ID Name Designator Footprint Quantity
1 1x3 ARRANCA,BEC,ON,SELECTOR HDR-3X1/2.54 4
2 1x2 BAT,D,ESC,I HDR-2X1/2.54 4
3 2.2UF C1,C4 0805 2
4 0.01UF C2,C5,C9 0805 3
5 10UF C3,C6 0805 2
6 220uF C7 CAP-SMD_BD8.0-L8.3-W8.3-FD 1
7 100uF C8 CAP-SMD_BD6.3-L6.6-W6.6-FD 1
8 LED D1 0805 1
9 LED D2 0805-LED 1
10 SK33B-LTP D3 SMB_L4.6-W3.6-LS5.3-RD 1
11 Mot DER,IZQ MOTOREDUCTOR CON SOPORTE 2
12 15uH L1 IND-SMD_L7.3-W7.3 1
13 SW MC1,SW1 KEY-TOUCH-SMD-6.0*3.5*H 2
14 1x5 PROG19,PROG23 HDR-5X1/2.54 2
15 200M R1,R2 0805 2
16 47K R3,R4 0805 2
17 6.2K R5 0805 1
18 2K R6 0805 1
19 330R RL1,RL2,RSW1 0805 3
20 10K RMC1 0805 1
21 1*7P SENSORES DIP-1X7P2.54 1
22 1x4 SERIAL DIP-1X4P-2.54MM-M 1
23 PIC16F1938-I/SS U1 SSOP-28_208MIL 1
24 DRV8833RTYR U2,U3 QFN-16_4X4X065P 2
25 PIC16F1823-I/SL U4 SOIC-14_L8.7-W3.9-P1.27-LS6.0-BL 1
26 TD1410P U6 SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL 1

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