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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD 6502-Based Computer

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Update time: 2019-10-01 08:15:36
Creation time: 2019-07-07 01:22:20
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ID Name Designator Footprint Quantity
1 27128 U2 DIP28-600 1
2 68B50 U4 DIP24-600 1
3 74LS00 U7 DIP14 1
4 74LS04 U6 DIP14 1
5 L7805CV U10 TO-220(TO-220-3) 1
6 DC-470-2.1GP DC1 DC-470-2.1GP 1
7 1N4004RLG D1 AXIAL-6.5X2.3(DIODES) 1
8 SS-12D02-VG4 SW1 SS-12D02-VG4 1
9 100nF C2,C3,C10,C11,C12,C13,C14,C15 CAP-CT4G-0805-5.08MM 8
10 470uF C1 CAP-D10.0XF5.0 1
11 6502CPU U1 DIP-40 1
12 62256 U3 28PIN-DIP-0.6 1
13 1.8432MHz X1 OSC-49U-1 1
14 270pF C4 CAP-0.2 1
15 2.2K R2,R3,R4,R5 AXIAL-0.4 4
16 MAX232N U5 PDIP-16 1
17 DMR-9P RS232 DMR-9P 1
18 1uF C5,C6,C7,C8,C9 CAP-D4.0XF1.5 5
19 12X12X7.3 RESET SW-DIP-12X12X7.3 1
20 204-10UYOC/S530-A3-L POWER_LED LED-3MM/2.54 1
21 120 R1 AXIAL-0.4 1

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