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2.The process supports design scales of 300 devices or 1000 pads

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2019-05-16 18:17:45
Creation time: 2019-05-16 18:16:10
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ID Name Designator Footprint Quantity
1 LM7805EE U1 TO-220 1
2 4700u C1 CAP-D3.0XF1.5 1
3 0.1u C2 CAP-D3.0XF1.5 1
4 SIN(0 230 50) AC 1 0 V2 HDR1X2 1
5 Mutual_Inductors T2 TRANSFORMER 1
6 MUR820 D1,D2,D3,D5 MUR820_TO-220AC_VERT 4
7 PIC16F877-04/P U2 PDIP-40 1
8 HD44780LCD X1 LCD1602 1
9 100 R1 AXIAL-0.3 1
10 10K R2 RES-ADJ_3386P 1
11 10k R3,R4,R5,R6,R7,R8,R9,R10 AXIAL-0.3 8
12 EVQ22705R SW1,SW2,SW3,SW4 KEY-6.0*6.0-4 4
13 SRD-05VDC-SL-C RELAY1,RELAY2 RELAY-SL-SRD 2
14 2N3904 Q1,Q2 TO-92(TO-92-3) 2
15 1N4007RLG D4,D6 DO-41 2
16 Header-Male-2.54_1x3 P1,P2 HDR-3X1/2.54 2
17 12MHz X2 OSC-49S-1 1
18 1u C3,C4 RAD-0.1 2
19 WJ2EDGVC-5.08-5P P3,P4 WJ2EDGVC-5.08-5P 2

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