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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2020-06-23 17:45:42
Creation time: 2018-04-14 12:53:32
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ID Name Designator Footprint Quantity
1 10p C4,C5,C8,C9,C10,C11 0402 6
2 10u C6,C7 0402 2
3 200 R20,R21,R22,R23,R34,R35,R36,R37,R42,R43 0402 10
4 1k R24,R25 0402 2
5 3.4k R26,R27,R30,R31,R38,R39 0402 6
6 100 R28,R29 0402 2
7 500 R32,R33 0402 2
8 50 R40,R41 0402 2
9 10u L4,L3,L5,L6,L7,L8 0603 6
10 1m L2,L1 0603 2
11 10 RN1,RN2,RN3,RN4,RN5 RES-ARRAY-SMD_0402-4P-L1.0-W1.0-BL 5
12 XC3S50A-4FTG256I U1 FTG256 1

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