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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2020-01-26 21:09:58
Creation time: 2019-09-12 17:03:33
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Supplier Part BOM_Manufacturer BOM_Manufacturer Part
1 330 R3,R6,R4 RES-TH_BD2.2-L6.5-P10.50-D0.6 3 LCSC C120043 Chian Chia Elec -
2 4.7K R8,R11 RES-TH_BD2.3-L6.5-P10.50-D0.5 2 LCSC C120071 Chian Chia Elec -
3 5AR2ST10 LED1,LED2,LED3 LED-5MM 3 LCSC C52721 KENTO 5AR2ST10
4 2N3904 Q1,Q2,Q3,Q4,Q5 TO-92(TO-92-3) 5 LCSC C118538 SEMTECH 2N3904
5 Header-Male-2.54_1x2 H2,H3,H4,H1,H5,H6,H7,H8,H9,H10,H11 HDR-2X1/2.54 11 LCSC C86471 TE Connectivity 826629-2
6 10K R2,R7,R5,R9,R10 AXIAL-0.4 5 LCSC C61299 UniOhm CFR0W4J0103A50
7 220 R1 RES-TH_BD2.3-L6.5-P10.50-D0.5 1 LCSC C120039 Chian Chia Elec -

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