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2.The process supports design scales of 300 devices or 1000 pads

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STD AMPLIFICADOR TERMOCUPLA

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Update time: 2020-05-16 13:07:48
Creation time: 2020-04-15 00:53:13
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ID Name Designator Footprint Quantity
1 1M R55,R7,R57,R58,R3,R56 AXIAL-0.4 6
2 100 R59,R60,R61,R62,R6,R2 AXIAL-0.4 6
3 0.1u C6,C5 RAD-0.1 2
4 520 R65,R66,R1,R64,R63,R4 RES-ADJ_3386P 6
5 INA131AP U11,U12,U13,U2,U8,U1 DIP8 6
6 1N4448 D4,D5,D9,D2,D3,D8,D1 DO-35 7
7 1.2k R5,R39 AXIAL-0.4 2
8 330 R40,R41 AXIAL-0.4 2
9 10K R48,R49,R46,R47 AXIAL-0.4 4
10 LTV-847 U10 DIP-16_16P-L20.2-W6.6-P2.54-LS7.6-BL 1
11 2N2222 Q1,Q2 TO-92-3_L4.9-W3.7-P1.27-L 2
12 220 R44,R45 AXIAL-0.4 2
13 RELAY_OMRON_G6C RL1,RL2 RELAY_OMRON_G6C 2
14 ESP8266 P4 ESP8266 NODEMCU 1
15 Header-Male-2.54_1x4 H1,H2,H3 DIP-1X4P-2.54MM-M 3
16 MAX485 Module U5 MAX485-MODULE-SIPPY 1
17 1u C1,C2 CAP-D10.0XF5.0 2
18 1u C3 CAP-D3.0XF1.5 1
19 Capacitor_Ceramic C4 CERAMIC CAPACITOR 1
20 WJ2EDGVC-5.08-12P P5 WJ2EDGVC-5.08-12P 1
21 LM7805CT U9 TO-220-3_L10.0-W4.5-P2.54-L 1
22 KF7.62-12P P6 KF7.62-12P 1
23 10k R53 AXIAL-0.4 1
24 20K R54 RES-ADJ_3386P 1
25 NTC R52 NTC 1
26 ADS1115_MODUL U7,U6 ADS115_MODUL 2

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