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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD AMPLIFICADOR TERMOCUPLA
Mode: Editors' pick
Amplificador simple lm324
Open in EditorINPUT
Open in EditorOUTPUT
Open in EditorCONTROL
Open in EditorCOMUNICATION
Open in EditorTERMINAL AND POWER
Open in EditorSENSOR TEMP AMBIENTE
Open in EditorADC MODULE
Open in EditorID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | 1M | R55,R7,R57,R58,R3,R56 | AXIAL-0.4 | 6 |
2 | 100 | R59,R60,R61,R62,R6,R2 | AXIAL-0.4 | 6 |
3 | 0.1u | C6,C5 | RAD-0.1 | 2 |
4 | 520 | R65,R66,R1,R64,R63,R4 | RES-ADJ_3386P | 6 |
5 | INA131AP | U11,U12,U13,U2,U8,U1 | DIP8 | 6 |
6 | 1N4448 | D4,D5,D9,D2,D3,D8,D1 | DO-35 | 7 |
7 | 1.2k | R5,R39 | AXIAL-0.4 | 2 |
8 | 330 | R40,R41 | AXIAL-0.4 | 2 |
9 | 10K | R48,R49,R46,R47 | AXIAL-0.4 | 4 |
10 | LTV-847 | U10 | DIP-16_16P-L20.2-W6.6-P2.54-LS7.6-BL | 1 |
11 | 2N2222 | Q1,Q2 | TO-92-3_L4.9-W3.7-P1.27-L | 2 |
12 | 220 | R44,R45 | AXIAL-0.4 | 2 |
13 | RELAY_OMRON_G6C | RL1,RL2 | RELAY_OMRON_G6C | 2 |
14 | ESP8266 | P4 | ESP8266 NODEMCU | 1 |
15 | Header-Male-2.54_1x4 | H1,H2,H3 | DIP-1X4P-2.54MM-M | 3 |
16 | MAX485 Module | U5 | MAX485-MODULE-SIPPY | 1 |
17 | 1u | C1,C2 | CAP-D10.0XF5.0 | 2 |
18 | 1u | C3 | CAP-D3.0XF1.5 | 1 |
19 | Capacitor_Ceramic | C4 | CERAMIC CAPACITOR | 1 |
20 | WJ2EDGVC-5.08-12P | P5 | WJ2EDGVC-5.08-12P | 1 |
21 | LM7805CT | U9 | TO-220-3_L10.0-W4.5-P2.54-L | 1 |
22 | KF7.62-12P | P6 | KF7.62-12P | 1 |
23 | 10k | R53 | AXIAL-0.4 | 1 |
24 | 20K | R54 | RES-ADJ_3386P | 1 |
25 | NTC | R52 | NTC | 1 |
26 | ADS1115_MODUL | U7,U6 | ADS115_MODUL | 2 |
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