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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2020-12-18 05:22:19
Creation time: 2019-10-29 09:40:09
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ID Name Designator Footprint Quantity
1 1N4148W D2,D1 SOD-123 2
2 0.1u C4,C3 0805 2
3 Audio P8 WJ2EDGV-5.08-4P 1
4 IRL530NPBF Q5 TO-220(TO-220-3) 1
5 Header-Male-2.54_1x3 H2 HDR-TH_3P-P2.54-V 1
6 470u C1 CAP-D6.3XF2.5 1
7 AMS1117-3.3 U2 SOT-223 1
8 1k R2,R1,R3,R4,R6 0805 5
9 10k R11,R10,R9,R8,R7,R5 0805 6
10 100k R21 0805 1
11 220k R22 0805 1
12 T78_(T74)_Relay K1,K2 T78_(T74)_RELAY 2
13 TS-1102-5016 KEY2,KEY1 KEY-6.0*6.0-2 2
14 ESP-07 U1 ESP-07 1
15 100u C2 CAP-D5.0XF2.0 1
16 Power P7 WJ2EDGVC-5.08-2P 1
17 highPower P3 WJ2EDGVC-5.08-2P 1
18 LED P6 WJ2EDGVC-5.08-2P 1
19 XH2.54-3P-M P11,P1,P2,P4,P5,P9 XH2.54-3P 6
20 BCM817 Q2,Q1 SOT-23(SOT-23-3)F 2
21 BC807-40 Q3 SOT-23(SOT-23-3) 1

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