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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2022-03-17 23:27:00
Creation time: 2018-03-24 19:59:34
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ID Name Designator Footprint Quantity
1 100nF C3 0805 1
2 10u C4 CAP-D3.0XF1.5 1
3 1u C5,C6 CAP-D5.0XF2.0 2
4 1u C7,C8 RAD-0.1 2
5 100n C9 RAD-0.1 1
6 22pF C10,C11 0805 2
7 1N4007RLG D1 DO-41 1
8 SS-60000-009 J1 SI-60000-009 1
9 LED-3MM LED1 LED-3MM/2.54 1
10 2.54 2*3P弯排母 P1 HDR-3X2H/2.54 1
11 Female header 2.54 1*5P P4 HDR-5X1/2.54 1
12 1k R1,R11 1206 2
13 40k R2 0805 1
14 20k R6,R7 AXIAL-0.3 2
15 120 Om R8 AXIAL-0.3 1
16 4.7k R10 AXIAL-0.3 1
17 10k R12,R13,R14 1206 3
18 SWITCH-6X6X5_TH SW2 SWITCH-6X6X5_TH 1
19 MAX485CSA+T U1 SOIC-8_150MIL 1
20 MAX7219CWG U3 SOIC-24_300MIL 1
21 ATmega328P-AU U4 LQFP-32_7X7X08P 1
22 L7805CV U5 TO-220(TO-220-3) 1
23 OSC-XTAL-HC-49U-PTH XTAL1 HC-49U-PTH 1

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