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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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STD clap circuit
License: Public Domain
Mode: Editors' pick
- 0
Update time：
2019-04-16 13:07:32
Creation time：
2019-03-26 20:52:43
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | RelayHT3F-12VDC-SHG | J1 | HT3F-12VDC-SHG | 1 |
| 2 | NE555P | U1 | DIP-8 | 1 |
| 3 | 10k | R1,R2,R3 | AXIAL-0.3 | 3 |
| 4 | 1k | R4,R5 | AXIAL-0.3 | 2 |
| 5 | 1uf | C1,C3 | RAD-0.1 | 2 |
| 6 | 1uf | C2 | CAP-D3.0XF1.5 | 1 |
| 7 | Header-Female-2.54_1x2 | P1,P2 | HDR-1X2/2.54 | 2 |
| 8 | BC547B Tube | Q1,Q2 | TO-92(TO-92-3) | 2 |
| 9 | BD139G | Q3 | TO-225AA | 1 |
| 10 | LED-3MM | LED1 | LED-3MM/2.54 | 1 |
| 11 | 1N4007RLG | D1,D2,D3,D4,D5 | DO-41 | 5 |
| 12 | CONECTOR_AC_3P | P3 | PCB_CONECTOR_AC_3P | 1 |
| 13 | 22uf | C4 | CAP-D3.0XF1.5 | 1 |
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