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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

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STD assembled pro micro

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Update time: 2021-01-23 15:18:36
Creation time: 2020-07-21 20:46:20
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Manufacturer Part BOM_Manufacturer BOM_Supplier Part
1 22pF C1,C2 C0603 2 LCSC CL10C220JB8NNNC SAMSUNG C1653
2 ATMEGA32U4-AU U1 QFP-44_L10.0-W10.0-P0.80-LS13.2-BL 1 LCSC ATMEGA32U4-AU MICROCHIP C44854
3 10K R3,R4 R0805 2 LCSC TC0525B1002T5E UniOhm C55866
4 22 R1,R2 R2010 2 LCSC 2010W2F220JT4S UniOhm C70404
5 16MHz X1 OSC-SMD_4P-L3.2-W2.5-BL 1 LCSC X322516MRB4SI YXC C70562
6 100nF C4,C5,C6 C0402 3 LCSC CL05B104KA5NNNC SAMSUNG C155422
7 4.7uF C7 C1206 1 LCSC 1206B475K500NT FH C29823
8 1uF C3 C0603 1 LCSC CL10A105KA8NNNC SAMSUNG C5673
9 TS-1187A-C-G-A SW1,SW2 SW-SMD_4P-L5.1-W5.1-P3.70-LS6.4 2 LCSC TS-1187A-C-G-A XKB Enterprise C318886
10 USB-310F USB1 USB-C-SMD_20P-P0.50-L6.5-W8.9 1 LCSC USB-310F HOOYA C309365

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