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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2021-04-11 23:36:56
Creation time: 2018-01-11 10:40:45
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ID Name Designator Footprint Quantity
1 MC33063ADR2G U1 SOIC-8 1
2 Header-Female-2.54_1x2 P1,P2 HDR-1X2/2.54 2
3 1000uF C1 CAP-D16.0XF7.5 1
4 0.22u C2 RAD-0.1 1
5 470nf C3 RAD-0.1 1
6 0.1u C4 RAD-0.1 1
7 0.22 R1 AXIAL-0.3 1
8 560k R2 AXIAL-0.3 1
9 330 R3 AXIAL-0.3 1
10 3k R4 AXIAL-0.3 1
11 SBYV26C-E3/54 D1 DO-41 1
12 5k R5 RES-ADJ_SF065 6.4x7.3 1
13 IRF840S Q1 D2PAK 1
14 470mh L1 AXIAL-0.4 1
15 4.7uF C5 CAP-D10.0XF5.0 1

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