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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD nRF51x22_qfaa

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Mode: Editors' pick

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Update time: 2019-11-13 10:59:53
Creation time: 2019-04-19 05:27:00
Description
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ID Designator Footprint Quantity
1 X1 BT-XTAL_2016_N 1
2 L3 RESC0402_N 1
3 C1,C2,C13,C14 RESC0402_N 4
4 C3,C16 RESC0402_N 2
5 C8,C11 RESC0402_N 2
6 C10 RESC0402_N 1
7 C9 RESC0402_N 1
8 C7 RESC0402_N 1
9 X2 XTAL_3215_N 1
10 U1 QFN40P600X600X90-48_N 1
11 C5 RESC0402_N 1
12 U2 QFN-24-4MM2 1
13 R2,R1,R4,R7,R8,R9 RESC0402_N 6
14 C12 RESC0402_N 1
15 C17,C18,C19 RESC0402_N 3
16 R6 RESC0402_N 1
17 R5 RESC0402_N 1
18 U3 QFN20_3MM_NOTHERMAL 1
19 L1 RESC0402_N 1
20 R3 RESC0402_N 1
21 U5 TBH-CR2032-M04 V2 1
22 D1,D2 SC-75(SOT-523) 2
23 AE1 ANT-SMD_2450AT18A100E 1
24 B1 FILTER-SMD_L1.60-W0.80 1
25 TP1 PAD.02X.02 1
26 TP2 PAD.02X.02 1
27 TP3 PAD.02X.02 1
28 TP4 PAD.02X.02 1

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