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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2021-02-03 10:36:25
Creation time: 2019-11-24 15:29:49
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ID Name Designator Footprint Quantity BOM_Manufacturer Part
1 BSS138_C52895 Q1 SOT-23-3_L2.9-W1.6-P1.90-LS2.8-BR 1 BSS138
2 U-C-M5DW-Y-1 PWR MICRO-USB-SMD_U-C-M5DW-Y-1 1 U-C-M5DW-Y-1
3 Header-Male-2.54_1x3 LOGIC,FET,CONVERTER,DIODE HDR-TH_3P-P2.54-V 4 Header2.54mm 1*3P
4 WEMOS D1 MINI U2 WEMOS D1 MINI 1 Wemos D1 mini
5 1N4001F D1 SMAF_L3.5-W2.6-LS4.7-RD 1 1N4001F
6 10K R1,R2 0603 2 0603WAF1002T5E
7 SN74AHCT125PWR U1 TSSOP-14_L5.0-W4.4-P0.65-LS6.4-BL 1 SN74AHCT125PWR

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