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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

Profession

1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

4.For enterprises, more professional users

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STD rwm3.0

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Update time: 2019-09-22 17:10:55
Creation time: 2019-09-21 06:12:39
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ID Name Designator Footprint Quantity
1 PC817C U1,U2,U3,U4,U5,U6 DIP4 6
2 RelayHT3F-12VDC-SHG K1 RELAY-TH_5PIN_HT3F-12VDC-SHG 1
3 MAX3232CSE+ U7 SO-16 1
4 1u C2,C3,C4,C5 CAP-D3.0XF1.5 4
5 SBC847BLT1G Q1 SOT-23(SOT-23-3) 1
6 1N4007 D1 DO-41 1
7 CONN-SIL-3 CN1 CONN-SIL-3 1
8 SIL6 J1 SIL6 1
9 10K R10,R6,R11,R12,R13,R3,R2,R4,R5,R7,R14,R15 R1206 12
10 330pF C1,C6,C7,C8,C9,C10 1206 6
11 MOSFET-NCHANNELBS170 Q2 TO-92 1
12 RES-1206 R16,R17,R18,R19,R8 R1206 5
13 CON-10P P1 CONECTOR MACHO 5.1MM X 10 1
14 SIL_4 P2 SIL_4 1

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