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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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Update time：
2020-12-03 13:17:48
Creation time：
2020-02-22 16:55:48
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | ESP8266-12E/ESP-12E | U1 | LGA22-2.0-24X16MM | 1 |
| 2 | SC1117-3.3V | U3 | SOT-223_L6.5-W3.5-P2.30-LS7.0-BR | 1 |
| 3 | 100n | C2,C3,C6,C7,C1,C11,C12 | 0805 | 7 |
| 4 | 68pf | C8,C9 | 0805 | 2 |
| 5 | 10uF | C10,C5,C4 | 0805 | 3 |
| 6 | EVQ22705R | SW1,SW2 | KEY-6.0*6.0-4 | 2 |
| 7 | 47k | R1,R2,R3,R4,R5 | 0805 | 5 |
| 8 | 1k | R6,R8 | 0805 | 2 |
| 9 | 22k | R7 | 0805 | 1 |
| 10 | Header-Male-2.54_1x1 | P1,P2,P3,P4,P5,P6,P8,P7 | HDR-1X1/2.54 | 8 |
| 11 | 17-21SURC/S530-A2/TR8 | LED1 | LED-0805 | 1 |
| 12 | PIC32MX440F512H-80IPT | U2 | TQFP64 | 1 |
| 13 | 25MHz | X1 | OSC-SMD_2P-L5.0-W3.2 | 1 |
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