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HiEnd_OPA1662

10 months ago 365
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Description

Documents

Sheet_1

PCB_HiEnd_OPAkorpuc

PCB_HiEnd_OPA

BOM

ID Name Designator Footprint Quantity BOM_Manufacturer Part
1 P6BU-0505 U1,U2 AM1PS 2 B0505D-1WR2
2 U-F-M5DW-Y-2 XP1 U-F-M5DW-Y-2 1 U-F-M5DW-Y-2
3 22uF C1,C5,C2 CASE-B_3528 3 TAJB226M016RNJ
4 Black headphone jack J1,J3,J2 AUDIO-PJ320 3 Black headphone jack
5 20 R2,R1 0805 2 0805W8F1002T5E
6 100u C6,C7 RAD-0.2 2 ?
7 20k R5,R7 0805 2 0805W8F1002T5E
8 10k R6,R8 0805 2 0805W8F1002T5E
9 1k R3,R4 0805 2 0805W8F1002T5E
10 LTL-307G HL1 LED-DIP-5MM 1 LTL-307G
11 2k R9 0805 1 0805W8F1002T5E
12 0.1 C3,C4 0805 2 ?
13 * C8,C9 0805 2 ?
14 10u C10,C11 1206 2 ?
15 MCP73831T-2ATI/OT U4 SOT-23-5 1 MCP73831T-2ATI/OT
16 5k1 R27 0805 1 0805W8F1002T5E
17 Header-Female-2.54_1x2 P1 HDR-1X2/2.54 1 2.54-1*2PFemale
18 OPA1662AID U3 SOIC-8 1 OPA1662AID

Attachments

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你现在访问的是EasyEDA海外版,使用建立访问速度更快的国内版 https://lceda.cn(需要重新注册)
如果需要转移工程请在个人中心 - 工程 - 工程高级设置 - 下载工程,下载后在https://lceda.cn/editor 打开保存即可。
有问题联系QQ 3001956291 不再提醒
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