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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2021-11-24 03:32:07
Creation time: 2020-03-23 16:46:51
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ID Name Designator Footprint Quantity
1 470uF C1,C2 CAP-TH_BD22.0-P10.00-D2.3-FD 2
2 100uF C3 CAP-TH_BD8.0-P3.50-D1.0-FD 1
3 1n C4 RAD-0.1 1
4 10uF C5 CAP-TH_BD4.0-P1.50-D0.8-FD 1
5 1u C6 RAD-0.1 1
6 1u-250v C7 RAD-0.1 1
7 2200U-50V C8,C9 CAP-D3.0XF1.5 2
8 1N5408 D1,D2,D3,D4 DO-35 4
9 FR107 D6 DO-35 1
10 15v-1w D7 DO-35 1
11 16v-1w D8,D13 DO-35 2
12 MUR1560 D9,D10,D11,D12 DO-35 4
13 5...10ohm NTC NTCLE400E3472H 1
14 IRF740 Q2 TO-220AB 1
15 100k R1,R2 AXIAL-0.3 2
16 27k-2w R3 AXIAL-0.3 1
17 18k R4 AXIAL-0.3 1
18 10 R5 AXIAL-0.3 1
19 1k R6 AXIAL-0.3 1
20 10k R7,R8 AXIAL-0.3 2
21 100-2w R9 AXIAL-0.3 1
22 12K-1/2W R10 AXIAL-0.3 1
23 IR2153 U1 DIP-8_L9.8-W6.6-P2.54-LS7.6-BL 1
24 fusible U2,U3 FUSE-TH_5X20RHOSFUSECLIP/SEAT 2
25 Trans ATX U4 TRANSF ATX 1

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