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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD BMS-spark

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Update time: 2020-03-29 07:57:21
Creation time: 2020-03-29 07:08:14
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Supplier Part BOM_Manufacturer BOM_Manufacturer Part
1 7805 U1 TO-220-3_L10.0-W4.5-P2.54-L 1 LCSC C305416 Foshan Blue Rocket Elec 7805
2 RelayHT3F-12VDC-SHG K1 RELAY-TH_HT3F-DCXX-X/X 1 LCSC C22022 HTV RelayHT3F-12VDC-SHG
3 1N4007G-K D1,D2,D3,D4 DO-204AL_BD2.4-L4.7-P8.70-D1.1-RD 4 LCSC C410859 Taiwan Semicon 1N4007G-K
4 Female header1*2P 3.7V,12V,O/P HDR-TH_2P-P2.00-V 3 LCSC C66509 BOOMELE Female header1*2P

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