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2.The process supports design scales of 300 devices or 1000 pads

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STD Hakko T12

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Update time: 2021-12-04 04:25:14
Creation time: 2016-12-14 09:45:21
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ID Name Designator Footprint Quantity
1 MCP601 U1 SOT23-5L 1
2 10k R1,R6,R9 0603 3
3 1M R2 0603 1
4 1k R3,R12 0603 2
5 68k R4 POT93YB 1
6 220k R5 0603 1
7 3.3V D1 SOD123 1
8 100k R7 0603 1
9 10k R8 B10K POT Large pads 1
10 7805 U2 D2PACKA 1
11 100n C1,C2 0805 2
12 1n C3 0805 1
13 SPST_OFF S1 TACTILE-PTH 1
14 IRF9540N T1 D2PACKA 1
15 18V D2 SOD123 1
16 PC817 U3 PC817 SMD 1
17 470 R10,R11 0603 2
18 +24V J1 H2-5.0-10.5X8.0MM 1
19 Solder P1 HDR1X2 1
20 ATTINY13 U4 SO-8 1
21 BC847B Q1 SOT23 1
22 BUZZER BZ BUZZER 1

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