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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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STD jetonmak
Mode: Editors' pick
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Update time：
2019-12-11 08:53:13
Creation time：
2019-11-29 11:48:18
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| ID | Name | Designator | Footprint | Quantity | BOM_Manufacturer Part |
|---|---|---|---|---|---|
| 1 | 47 | R1 | 0805 | 1 | AC0805FR-0747RL |
| 2 | 104 | C1 | 0805 | 1 | 0805B106K100NT |
| 3 | IRC15W107-35I-SOP8 | BUCK | SOP-8_L5.0-W4.0-P1.27-LS6.2-BL | 1 | IRC15W107-35I-SOP8 |
| 4 | 56K | R4 | 0805 | 1 | AC0805FR-0756KL |
| 5 | BC817 | Q1,Q2 | SOT-23(SOT-23-3) | 2 | BC817 |
| 6 | PIC18F45K22-I/PT | U2 | TQFP-44_10X10X08P | 1 | PIC18F45K22-I/PT |
| 7 | 4.7K | R7,R11 | 0805 | 2 | RC0805FR-074K7L |
| 8 | L78L05 | U1 | SOT-89(SOT-89-3) | 1 | New SchematicLib |
| 9 | 39K | R9,R10 | 0805 | 2 | RMC080539K1%N |
| 10 | 10nF | C3 | 0603 | 1 | 0603B103K500NT |
| 11 | Header-Male-2.54_1x5 | H1 | HDR-TH_5P-P2.54-V | 1 | 210S-1*5P L=11.6MMGold-plated black |
| 12 | 2.2K | R2,R6 | 0805 | 2 | RMC08052.2K5%N |
| 13 | B5819W | D1 | SOD-123_L2.8-W1.8-LS3.7-FD | 1 | B5819W |
| 14 | USBA-1JS (DS1095-10) | USB1 | USBA-1JS (DS1095-10) | 1 | USBA-1JS (DS1095-10) |
| 15 | 12.1K | R5 | 0805 | 1 | RMC080512.1K1%N |
| 16 | 10K | R8,R12,R3 | 0805 | 3 | AECR0805F10K0K9 |
| 17 | WJ127-5.0-2P | SENSR,AKU | WJ127-5.0-2P | 2 | WJ127-5.0-2P |
| 18 | 22uF | C2 | CAP-CASE-A_3216 | 1 | CA45-A-10V-22uF-K |
| 19 | 10uH | L1 | IND-SMD_L6.0-W6.0 | 1 | CKCS6028-10uH/M |
| 20 | 51pF | C4 | 0603 | 1 | 0603CG510J500NT |
| 21 | GMD12095YB-24V2400 | BUZZER1 | BUZZER-R6.0-2P-7.6MM | 1 | GMD12095YB-24V2400 |
| 22 | Header-Female-2.54_1x16 | P2 | HDR-TH_16P-P2.54-V | 1 | Female header1*16P pitch 2.54mm |
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