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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD Henny Penny

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Update time: 2020-11-11 16:21:59
Creation time: 2019-10-06 22:01:22
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ID Name Designator Footprint Quantity
1 746 CX V1,V3 SMB_L4.6-W3.6-LS5.3-BI 2
2 J49 KE V4,V2 SMB_L4.6-W3.6-LS5.3-BI 2
3 WJ2EDGVC-5.08-4P P14 WJ2EDGVC-5.08-4P 1
4 WJ2EDGVC-5.08-5P P2,P3 WJ2EDGVC-5.08-5P 2
5 WJ2EDGVC-5.08-3P P9 WJ2EDGVC-5.08-3P 1
6 10k R6 0402 1
7 Female header 2.54-1*14P P1 HDR-TH_14P-P2.54-V 1
8 X250 IDAE F1 F-DIP-21.3X3.1 1
9 10 R2 0805 1
10 WJ2EDGVC-5.08-12P P13 WJ2EDGVC-5.08-12P 1
11 0 J1 AXIAL-1.0 1
12 6.8uF C9,C14 CASE-B_3528 2
13 WJ2EDGVC-5.08-2P P4 WJ2EDGVC-5.08-2P 1
14 WJ2EDGVC-5.08-06P P5,P11 WJ2EDGVC-5.08-6P 2
15 5A 250VAC F5,F3,F2 5X20 3
16 10317224F001_C405301 USB? USB-C-SMD_10317224F001 1
17 S5GC D1 SMC_L6.9-W5.9-LS7.9-RD 1
18 J27 LE DV1 SMB_L4.6-W3.6-LS5.3-BI 1
19 LM2675MX-3.3/NOPB U1,U2 SOIC-8_150MIL 2
20 SK220 D2,D3,D4,D6,D7 SMA_L4.4-W2.6-LS5.0-RD 5
21 150uF C6,C11 CAP-D8.0X11.5 2
22 1000uF C10,C4 CAP-TH_BD16.0-P7.50-D1.2-FD 2
23 10nF C3,C2,C1,C7,C13,C15 0402 6
24 82uF C5,C12 CAP-D10.0XF5.0 2
25 47uH L1,L2 L6060 2
26 H11AA1SM U11,U4,U5,U6,U9,U10,U7,U8 SOP-6_L8.5-W6.4-P2.54-LS9.2-BL 8
27 Schrack RT114730 RL1,RL2,RL4 SCHRACK RT1 SPCO 3
28 649 R12,R12A,R11A,R11,R10A,R10,R9A,R9,R8A,R8,R7A,R7,R17A,R17,R18A,R18,R19A,R19,R20A,R20,R21A,R21,R22,R22A 0805 24
29 SN74LS165ADR U3 SOIC-16_L9.9-W3.9-P1.27-LS6.0-BL 1
30 103 RN1 CAY17-102 1
31 0 J3,J4 1206 2
32 3K R4 0201 1
33 10 R3 0201 1

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