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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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Update time: 2021-04-11 16:50:53
Creation time: 2017-07-13 14:38:30
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ID Name Designator Footprint Quantity
1 NE555 U1 DIL-08 1
2 100uH L1 AXIAL-0.4 1
3 Header-Male-2.54_1x2 P1 HDR-2X1/2.54 1
4 UF4004 D1 DO-35 1
5 irf740 Q1 TO-92(TO-92-3) 1
6 2k2 R1 AXIAL-0.3 1
7 100p200V C1 RAD-0.1 1
8 BC547 Q2 TO-92(TO-92-3) 1
9 1K R2 RES-ADJ_3386P 1
10 220k R3 AXIAL-0.3 1
11 1k R4 AXIAL-0.3 1
12 10k R5 AXIAL-0.3 1
13 470u C2 CAP-D3.0XF1.5 1
14 GS009S-2P-2 J1 H2-5.0-10.5X8.0MM 1
15 2n2 C3 RAD-0.1 1
16 4u7F200V C4 CAP-D3.0XF1.5 1

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