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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD 5V zahranvane

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Update time: 2019-11-17 18:29:03
Creation time: 2019-11-13 15:21:33
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ID Name Designator Footprint Quantity
1 PC817X1NSZ2B U1 DIP-4_L4.6-W6.5-P2.54-LS7.6-BL 1
2 220k R1,R2 AXIAL-0.3 2
3 0.1u R9 AXIAL-0.3 1
4 2.2k R10 AXIAL-0.3 1
5 3k R11 AXIAL-0.3 1
6 33 R8 AXIAL-0.3 1
7 120k R4 AXIAL-0.3 1
8 2 R6,R7 AXIAL-0.3 2
9 100 R5 AXIAL-0.3 1
10 1k R3 AXIAL-0.3 1
11 10u C1 CAP-D3.0XF1.5 1
12 2SC945 Q1 TO-92_3PIN-L4.95-W3.94-PITCH2.54-L 1
13 TL431 U2 TO-92 1
14 FR107 D6,D5 DO-41 2
15 0.1u C5,C3,C9,C8 RAD-0.1 4
16 1n - 1kV C4 RAD-0.1 1
17 1u C2 RAD-0.1 1
18 1N5822 D8 DO-27 1
19 Header-Female-2.54_1x1 P9,P8,P2,P7,P3,P5,P4,P6,P1,P10 HDR-1X1/2.54 10
20 DROSEL 8mm L1 MY DROSEL 8MM 1
21 1000uF C7,C6 CAP-TH_BD10.0-P5.00-D1.0-FD 2
22 MJE13003 Q2 TO-126_L8.3-W3.5-P2.29-T 1
23 1N4007 D2,D4,D1,D3 DO-41 4

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