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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
Profession
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
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STD New_Proekt
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Update time：
2020-10-06 16:08:24
Creation time：
2019-12-11 22:37:45
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| ID | Name | Designator | Footprint | Quantity |
|---|---|---|---|---|
| 1 | KT315Б | VT1,VT2,VT3,VT4 | КТ-13 | 4 |
| 2 | К155ТМ2 | DD3,DD4 | DIP14 | 2 |
| 3 | К155ЛА3 | DD2 | DIP14 | 1 |
| 4 | k VS2 | VS2 | КОНТАКТ | 1 |
| 5 | SA1 | "6","7","2","1","0","5","3","MASSA"1,"4" | КОНТАКТ | 9 |
| 6 | k VS1 | VS1 | КОНТАКТ | 1 |
| 7 | k VS4 | VS4 | КОНТАКТ | 1 |
| 8 | k VS3 | VS3 | КОНТАКТ | 1 |
| 9 | k R2 | X1(R2),X2(R2),X3(R2) | КОНТАКТ | 3 |
| 10 | 330uF | C1 | CAP-TH_BD6.3-P2.50-D1.0-FD | 1 |
| 11 | К155ЛЕ1 | DD1 | DIP14 | 1 |
| 12 | LC1258OASP | SB1 | SW-DIP-PN11 | 1 |
| 13 | 470 | R7,R8,R9,R10 | RES-TH_BD2.2-L6.5-P10.50-D0.6 | 4 |
| 14 | 5.1K | R3,R4,R5,R6 | RES-TH_BD2.3-L6.5-P10.50-D0.5 | 4 |
| 15 | WJ124-3.81-2P | P1 | CONN-TH_2P-P3.81_KF124-3.81-2P | 1 |
| 16 | 510 | R1 | RES-TH_BD2.2-L6.5-P10.50-D0.6 | 1 |
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