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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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Update time: 2019-04-16 02:11:53
Creation time: 2019-04-12 07:38:18
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ID Name Designator Footprint Quantity BOM_Supplier BOM_Supplier Part BOM_Manufacturer BOM_Manufacturer Part
1 HF3FA/012-ZST K1,K2,K3,K4 RELAY-5P-DIP-15.2X19.0-H15.5-HF3FA 4 LCSC C340664 Xiamen Hongfa Electroacoustic HF3FA/012-ZST
2 GND P1 HDR-1X1/2.54 1 LCSC C81276 ReliaPro Header-Male-2.54_1x1
3 VCC P2 HDR-1X1/2.54 1 LCSC C81276 ReliaPro Header-Male-2.54_1x1
4 IN1 P3 HDR-1X1/2.54 1 LCSC C81276 ReliaPro Header-Male-2.54_1x1
5 IN2 P4 HDR-1X1/2.54 1 LCSC C81276 ReliaPro Header-Male-2.54_1x1
6 IN3 P5 HDR-1X1/2.54 1 LCSC C81276 ReliaPro Header-Male-2.54_1x1
7 IN4 P6 HDR-1X1/2.54 1 LCSC C81276 ReliaPro Header-Male-2.54_1x1
8 OUT1 P7 HDR-1X1/2.54 1 LCSC C81276 ReliaPro Header-Male-2.54_1x1
9 OUT2 P8 HDR-1X1/2.54 1 LCSC C81276 ReliaPro Header-Male-2.54_1x1
10 OUT3 P9 HDR-1X1/2.54 1 LCSC C81276 ReliaPro Header-Male-2.54_1x1
11 OUT4 P10 HDR-1X1/2.54 1 LCSC C81276 ReliaPro Header-Male-2.54_1x1

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