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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

4.For students, teachers, creators

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

3.More rigorous design constraints, more standardized processes

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STD OJO1234567

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Update time: 2019-12-09 23:35:01
Creation time: 2019-12-04 00:44:30
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ID Name Designator Footprint Quantity
1 SN74LS85N U12 DIP16 1
2 4510 U13 DIP16 1
3 bornera pro2 U1 BORNERA 2 PROYE 1
4 10u C1 CAP-D3.0XF1.5 1
5 HDSP-5501 LED2 LED-SEG-TH_HDSP-A 1
6 100k R11 AXIAL-0.3 1
7 22K R14 AXIAL-0.3 1
8 330 R12 AXIAL-0.3 1
9 1N4148 D1,D2 DO-35_BD2.0-L4.0-P8.00-D0.5-FD 2
10 CRCW1210100KFKEA R1,R2,R3,R4,R5,R6,R7,R8,R9,R10 RESC3225X71N 10
11 SW BT1,BT2,BT3,BT4,BT5,BT6,BT7,BT8,BT9,BT10 CON3 10
12 CD4511BM/TR U11 SOP-16_L10.0-W3.9-P1.27-LS6.0-BL 1
13 CD4071BCM U2 SOIC14N 1
14 MC14069UBCP U3,U4,U5,U6 DIP14 4
15 CD4027BCM U7,U8,U9,U10 SOIC16N 4

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