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2.The process supports design scales of 300 devices or 1000 pads

3.Supports simple circuit simulation

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1.Brand new interactions and interfaces

2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD MeteoStation

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Update time: 2022-04-16 12:54:25
Creation time: 2017-09-14 14:50:48
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ID Name Designator Footprint Quantity
1 39k R3 R0805 1
2 ESP8266-12E/ESP-12E U2 LGA22-2.0-24X16MM 1
3 PINHD-1X4 JP2 HDR1X4 1
4 PINHD-1X2 U4,U7 HDR1X2 2
5 22k R5,R9 R0805 2
6 100k R6 RES-ADJ_3386P 1
7 0k R7,R11 R0805 2
8 MCP1700T-3302ETT U5 SOT23-3 1
9 1M R10 RES-ADJ_3386P 1
10 MMBT2222A Q2,Q3 SOT23-3 2
11 1k R12 R0805 1
12 100n C2 C1206 1
13 1N4148 D1 DO-35 1
14 204-10UYC/S530-A3 LED1 LED-3MM/2.54 1
15 1000u C3 CAP-D3.0XF1.5 1
16 MCP6041T-EOT U1,U3 SOT23-5 2
17 SWITCH-6x6x5_TH SW1,SW2 SWITCH-6X6X5_TH 2
18 100 R15 R0805 1
19 MCP1700T-1502ETT U6 SOT23-3 1
20 100n C1 C0805 1
21 500k R1 RES-ADJ_3386P 1
22 3M3 R8 R0805 1
23 680k R16 R0805 1
24 470 R2 R0805 1
25 10k R4 R0805 1
26 IRF4905PBF Q1 TO-220(TO-220-3) 1

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