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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD Portable Soldering Iron
Mode: Editors' pick
Compoment Separation
Open in EditorPCB (50mm*100mm)
Open in EditorPanalized PCB (100*100)mm
Open in EditorFor half space in double 86 box
Open in Editor49*49
Open in EditorFor half space in double 86 box copy
Open in EditorID | Name | Designator | Footprint | Quantity |
---|---|---|---|---|
1 | IRF4905 | Q1 | TO-220AB | 1 |
2 | Headers_Pins2.54 | P1 | HDR-2.54-1X13P | 1 |
3 | 1M | R7 | AXIAL-0.4 | 1 |
4 | 2k | R10,R9 | AXIAL-0.4 | 2 |
5 | 10k | R3,R1,R6,R8 | AXIAL-0.4 | 4 |
6 | 1k | R4,R2 | AXIAL-0.4 | 2 |
7 | 200k | R5 | AXIAL-0.4 | 1 |
8 | 1mF | C7 | CAP-D8.0XF3.5 | 1 |
9 | compact 360 buck convertor | U4 | SUPER COMPACT 360 BUCK CONVERTOR PACKAGE | 1 |
10 | vibrate sensor | S1 | VIBRATE SENSOR | 1 |
11 | ATmega328-PU | U3 | DIP28 | 1 |
12 | 4PIN | U2 | PIN4 | 1 |
13 | button6*6*8 | KEY1,KEY2 | KEY-TH_4P-L6.0-W6.0-P4.50-LS7.5 | 2 |
14 | 22nF | C8 | RAD-0.1 | 1 |
15 | 10nF | C6,C5 | RAD-0.1 | 2 |
16 | 100nF | C3,C2,C4 | RAD-0.1 | 3 |
17 | 2N3904 | Q2 | TO-92-3_L5.1-W4.1-P1.27-L | 1 |
18 | 1N5819-B | D1 | DO41-7.6 | 1 |
19 | Output Screw | J2 | H2-3.5-7.0X7.0MM | 1 |
20 | INPUT Screw | J1 | H2-3.5-7.0X7.0MM | 1 |
21 | 2.2nF | C1 | RAD-0.1 | 1 |
22 | CRYSTAL_16MHz | Y1 | HC49U-V | 1 |
23 | HA17358B | U1 | DIP-8 | 1 |
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