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1.Easy to use and quick to get started
2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
4.For students, teachers, creators
1.Brand new interactions and interfaces
2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
3.More rigorous design constraints, more standardized processes
4.For enterprises, more professional users
STD Multi IO Mega shield
License: CERN Open Hardware License
Mode: Editors' pick
ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Manufacturer | BOM_Manufacturer Part | BOM_Supplier Part |
---|---|---|---|---|---|---|---|---|
1 | 1805533 | CN01 | MKDS3/4-5.08 | 1 | tme | Phoenix Contact | MKDS3/4-5.08 | C90087 |
2 | WJ250A-3.50-2P | CN02 | WJ250A-3.50-2P | 1 | tme | ReliaPro | WJ250A-3.50-2P | C8421 |
3 | 4k7 | R01,R02,R03,R04,R05,R06,R13 | AXIAL-0.3 | 7 | LCSC | TyoHM | RN1/2W1MΩFT/BA1 | C385586 |
4 | Header-Male-2.54_2x2 | P1,P2,P3 | HDR-TH_4P-P2.54-V-R2-C2-S2.54 | 3 | LCSC | BOOMELE | Double Rows2.54mm2*2pHeaders Pins | C66690 |
5 | MEGAARDUINO_2560_R3 | NO | MEGA_2560_ELEGOO | 1 | Amazon | ELEGOO | MEGA2560 R3 | ELEGO MEGA2560 R3 |
6 | FOD817C | U1,U2,U3,U4,U5,U6 | DIP-4_L6.4-W4.6-P2.54-LS7.6-BL | 6 | LCSC | FAIRCHILD | FOD817C | C7438 |
7 | 9k1 | R10,R11,R12 | RES-TH_BD1.9-L3.3-P7.30-D0.5 | 3 | LCSC | Chian Chia Elec | - | C119135 |
8 | 22uF | C1 | 22UF_50V | 1 | tme | ValuePro | 22uF 25V 4*7 | C43840 |
9 | 1K | R7,R8,R9 | RES-TH_BD3.3-L9.0-P13.00-D0.6 | 3 | LCSC | Chian Chia Elec | - | C119418 |
10 | EK508V-03P | CNA01,CNA02,CNA03,CNR01,CNR02,CNR03,CNR04,CNR05,CNR06,CN1W07,CN1W08,CN1W10,CN1W09,CN1W12,CN1W11,CN1W05,CN1W06,CN1W03,CN1W04,CN1W02,CN1W01 | EK508V-03P | 21 | LCSC | Dinkle | EK508V-03P | C99393 |
11 | G5LE-14_DC5 | REL01,REL02,REL03,REL04,REL06,REL05 | G5LE-1A4 DC5 | 6 | Digi-Key | OMORON | G5LE-1A4 DC5 | Z3116-ND |
12 | 50SQ100 | D2,D1,D6,D5,D3,D4 | DO-15_BD3.1-L6.7-P10.70-D0.9-RD | 6 | LCSC | Chongqing Pingwei Tech | SB260 | C360275 |
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