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2.The process supports design scales of 300 devices or 1000 pads
3.Supports simple circuit simulation
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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads
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STD DTISP copy
License: GPL 3.0
Mode: Editors' pick
Cloned from DTISP
- 0
Update time：
2019-05-25 13:58:06
Creation time：
2019-05-23 15:28:58
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| ID | Name | Designator | Footprint | Quantity | BOM_Supplier | BOM_Manufacturer | BOM_Manufacturer Part | BOM_Supplier Part |
|---|---|---|---|---|---|---|---|---|
| 1 | MICRO USB | USB1 | MICRO-USB-1 | 1 | LCSC | LCSC | MICRO USB 5S B | C10418 |
| 2 | 100nF | C1,C4,C5,C6 | 0402 | 4 | LCSC | Samsung Electro-Mechanics | CL05A104MO5NNNC | C307412 |
| 3 | ATMEGA328P-AU | U2 | TQFP-32_7X7X08P | 1 | LCSC | MICROCHIP | ATMEGA328P-AU | C14877 |
| 4 | 10K | R1 | 1206 | 1 | LCSC | RALEC | RTT06103JTP | C104602 |
| 5 | K2-1187SQ-A4SW | SW1 | KEY-5.2*5.2 | 1 | LCSC | HRO | K2-1187SQ-A4SW | C92584 |
| 6 | Header-Male-2.54_2x3 | ICSP_IN,ICSP_OUT | HDR-3X2/2.54 | 2 | LCSC | BOOMELE | Header-Male-2.54_2x3 | C65114 |
| 7 | 8MHz | X1 | X20608MSD2SC | 1 | LCSC | YXC | X20608MSD2SC | C2170 |
| 8 | 25pF | C7,C8 | 0603 | 2 | LCSC | SAMSUNG | CL10C250JB8NNNC | C159793 |
| 9 | TJ-L3FYTGHTFCLFLC2R-A5 | PMODE,HB,ERR | LED-DIP-3.9MM | 3 | LCSC | TOGIALED | TJ-L3FYTGHTFCLFLC2R-A5 | C330746 |
| 10 | 220 | R2,R3,R4 | 1206 | 3 | LCSC | ResistorToday | AECR1206F220RK9 | C352117 |
| 11 | Header-Male-2.54_1x3 | VCC_IO | HDR-3X1/2.54 | 1 | LCSC | BOOMELE | Header2.54mm 1*3P | C49257 |
| 12 | CH340G | U1 | SOIC-16_150MIL | 1 | LCSC | WCH | CH340G | C14267 |
| 13 | 12MHz | X2 | OSC-49S-1 | 1 | LCSC | YXC | X49SD12MSD2SC | C16369 |
| 14 | 22pF | C2,C9 | 0402 | 2 | LCSC | SAMSUNG | CL05C220JB5NNNC | C70464 |
| 15 | 10nF | C3 | 0603 | 1 | LCSC | YAGEO | CC0603KRX7R9BB103 | C100042 |
| 16 | AP2112K-3.3TRG1 | U3 | SOT-25 | 1 | LCSC | DIODES | AP2112K-3.3TRG1 | C51118 |
| 17 | 1uF | C10,C11 | 0603 | 2 | LCSC | SAMSUNG | CL10A105KB8NNNC | C15849 |
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