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2.The process supports design scales of 300 devices or 1000 pads

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2.Smooth support for design sizes of over 5,000 devices or 10,000 pads

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STD HIFI-TPA6120a2_Headphone_Amp

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Update time: 2020-10-15 04:05:48
Creation time: 2020-08-02 14:07:54
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ID Name Designator Footprint Quantity
1 1k R10,R17,R3,R4,R5,R6 C0805 6
2 10k R11,R16 C0805 2
3 100 R12,R15 C0805 2
4 220k R13,R14 C0805 2
5 470u C13,C14 CAP-D10.0×F5.0 2
6 OPA2134UA/2K5 U4 SOIC-8_L4.9-W3.9-P1.27-LS6.0-BL 1
7 0.1u C1,C2,C7,C8,C9,C10,C11,C12 MKS2_0.1UF 8
8 1k R7,R8,R19,R20 R0805 4
9 HDR-M-2.54_1x2 J4,J5,J1,J6 HDR-M-2.54_1X2 4
10 HDR-M-2.54_1x3 J2 282836-3_KLEMMLEISTE_TE 1
11 HDR-M-2.54_1x3 J3 HDR-M-2.54_1X3 1
12 1n C15,C18 FKP 10NF 2
13 100n C16,C17 ECWFE 0,1UF 2
14 38,2 R1,R2 0.6W DFW 2
15 470 R9,R18 C0805 2
16 10u C3,C4,C5,C6 CAP-D5.0×F2.0 4
17 TPA6120A2DWP U1 TI-DWP20-3730X2350TP_N 1

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