Sorry, my question probably sounds dumb... However, maybe someone might
help me to solve my issue. I successfully created some simple projects with
EasyEDA and JLCPCB. However, now I am trying to place a TI DRV8301 BLDC driver on
a PCB. I was using the JLCPCB symbol that already has a ground/power/thermal
pad as required. However, I cannot simply add vias for connection with a ground
plate and head dissipation as suggested in the datasheet of the chip. Everytime
when I try to place vias in the ground pad, the DRC check outputs that the
clearance between the two objects (the via and the power pad) is lower than the
design rule. In addition, I can place only one via at the center of the power
pad. Thank you very much for any hint on how to solve this issue.
Best, Tobias
Chrome
88.0.4324.190
Windows
10
EasyEDA
6.4.17