Is it a good or bad idea to use multilayer GND pads, to 1) connect to ground plane, and 2) also be a ground pad for SMD LEDs? Wondering whether I’m risking poor connection, and whether solder could wick into the multilayer pad’s hole? See pic, left out copper pour so easier to visualize.
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Also, I'm working on second revision of my first custom PCB board, so general constructive ridicule is also much appreciated!
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Am using EasyEDA to update my dimension constrained 2 layer PCB that’s crammed full of WS2812B-MINI 3535 RGB LEDs. Cramming as many LEDs as I can around the perimeter.
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This v2 revision has 0.6mm or larger traces where possible. Reason is my v1 boards (assembled by JLCPCB via their SMD service) used 0.254mm signal traces, but they don’t work… Observing flickering, and non responsive LEDs, fault location(s) varies from board to board. Many LEDs have non functioning R or G or B colors, or don’t light up at all but still transmit data to the next LED, maybe… Don’t have eyes or microscope powerful enough to inspect LED’s internal wiring. However, applying manual pressure at different points onto some misbehaving LEDs can momentarily cause them to function. This makes me suspicious of the LED quality. Currently using WorldSemi WS2812B-MINI 3535. I’d try SK6812 but jlcpcb/lcsc don’t have stock for needed size. Contemplating redesigning board with 5050, but layout will be trickier because I can’t change overall board dimension, has to fit in an existing housing.
Thinking my code is fine (?) because my adafruit neopixel strip (with SK6812 5050 shiji lighting LEDs) works fine. However, the Worldsemi LED spec (google translated) mentions “The port scanning frequency is 2KHz.”, haven’t figure out yet if/how that affects how I should tweak signal timing within the Adafruit neopixel library. Fun!
Thanks for reading, cheers!
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