This allow to get solder paste stencil hole smaller than the pad.
(See Footprint page 9 in [http://www.st.com/content/ccc/resource/technical/document/datasheet/a7/86/d3/98/2c/7f/4b/d2/CD00217829.pdf/files/CD00217829.pdf/jcr:content/translations/en.CD00217829.pdf)](http://www.st.com/content/ccc/resource/technical/document/datasheet/a7/86/d3/98/2c/7f/4b/d2/CD00217829.pdf/files/CD00217829.pdf/jcr:content/translations/en.CD00217829.pdf)
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