I want to use a Recom RPM5.0-1.0 DC/DC converter. Its footprint is a 5x5 array of 1x1mm square pads (see below).![epson206.jpg](//image.easyeda.com/pullimage/jWZlQDsJHVQ8KbE6fVlx9pqTJFhaJnFcnts1f1lN.jpeg)
I have no experience of devices with this kind of footprint. It seems the green pads should all be connected to the ground plane (which is on the other side of the PCB) for thermal reasons. What's the best way of doing this? I'm assuming it would be a bad idea to make the pads into small vias (I don't think I can create square vias anyway). Should one just run a narrow trace between all the green pads and bring it out beside the device where vias could go to the ground plane? If so, what trace width would you suggest? Or should one revise the footprint to block up the green pads into one piece of copper (I'm thinking that might undermine the self-locating behaviour of such arrays as the solder melts)?
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