"In the past I had a project where the 230V paths had to handle 10A, for this I didn't have better idea than to use the biggest width fit on my schematic (5mm) and make it double sided and connected with VIAs to give a double surface area." You were given detailed help about how to handle such a design in this post: [https://easyeda.com/forum/topic/Trace-width-for-10-Amps-8d27666daa37462497f2ec9077b60181](https://easyeda.com/forum/topic/Trace-width-for-10-Amps-8d27666daa37462497f2ec9077b60181)<br> <br> " I could feel the device getting hot and if you calculate that: I=P/U=1100W/230V=4.7A It is only half of the planned capacity so on 10A this thing couldve burn I never tried." Do you mean a semiconductor device or the traces on the PCB? You have not stated what temperature rise you consider acceptable and you have not given any temperature measurements so it is not clear exactly what "hot" actually means in your design. You must decide on an acceptable temperature rise and then design for the calculated trace width. The reply to your original post gives several suggestions for how to design connections to and between multilayer copper tracks. If your tracks are still hotter than the desired temperature rise then the options are to: 1. increase the copper width (and if available, thickness);  2. increase the airflow over the board;  3. use more layers;  4. use a specially designed thicker copper or metal core PCB material.

Hi! It would be nice that JLCPCB could have 3-4oz copper capabilities for these kind of projects in the future. That would seriously help designing more current handling projects like these. Regards, Markus Virtanen HW / Electronics Designer

@markus_jidoka, How about posting that as a Feature Request? :)