I'm trying to lay the board out to support both DIP and SOIC ICs as availability tends to be random. Other PCB packages have this as standard but I can't seem to find one in EasyEDA. Does anybody have this already made up ?
Thanks
I don't know of any in the library but they easy enough to make.
Clone a DIP (or SOIC) footprint then open the appropriate SIOC (or DIP) footprint for editing and then cut and paste it into the cloned footprint.
Connect the pins to each other using the Track tool but don't assign any net names to the tracks.
Make sure that the pin numbering of both dip and SOIC match pin for pin (i.e. pin 1of the dip and pin 1 of the SOIC line up and have the same numbers) and don't overlap the SOIC silkscreen on the dip pads.
Save it with a unique name and add a description and up to 5 tags.
To use it, set the package attribute of the schematic symbol that you want to use it to the name you have just given to it.
Thanks - I ended up just putting down a DIP and SOIC version of the IC on the schematic and bussed them together. Bit primitive but it does allow me then to centre the SOIC over either the left or right hand side pins of the DIP on an individual basis.
If you then set the **Mounted** attribute in each device in the schematic then you have the "proper" way to do it because the BoM will reflect what is actually being fitted to the PCB
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