Hi All, I'm new to the EasyEDA software and was wondering if I'm going about it the right way. I'm trying to create a thermal via. The steps I took was to add via's to the IC's thermal pad and create a solid region on the bottom layer of the board. Is this the correct way of doing it in EasyEDA ? Please see image : ![thermal via][1] [1]: /editor/20171214/5a325a6b30a71.png Ta