Hi All,
I'm new to the EasyEDA software and was wondering if I'm going about it the right way.
I'm trying to create a thermal via. The steps I took was to add via's to the IC's thermal pad and create a solid region on the bottom layer of the board. Is this the correct way of doing it in EasyEDA ?
Please see image :
![thermal via][1]
[1]: /editor/20171214/5a325a6b30a71.png
Ta