``` Hello how are you; a very happy year to all. I was making a PCB and I'm occupying an integrated circuit "PIC18F26K22T-IML", which has a pin "EP that is No. 29", my big question is, this pin will have to solder it to GND, since it is the part of dissipation of the IC. On the other hand, in the design manager I see several errors regarding the IC dissipation pad, for example: Via Diameter, Via Diameter of Board and Via to PAD. I hope you can help me with this, since it is my first time with this type of encapsulation, greetings. Pedro. ```