I'm about to release. I have some final questions. 1) How close can I get to the edge of the board or to a hole? The DRC doesn't seem to check the board edges and the holes. My closest edge of trace to the center of the board boundary is 17 mils. Is this a problem? 2) I have a VQFP-64 package with 0.5 mm pitch between pins. The default setting of 8 mils for pad-to-pad and pad-to-trace fails in the DRC. I had to set them both to 6 mils to fix all the errors. Is 6 mils going to be OK? 3) I see one of the layers to choose from is the top solder layer. I don't need to use this, right? Will a solder mask be automatically generated from the pads? 4) This board is going to be an arduino shield. I put in a border with the matching shape that is not rectangular. Will I pay extra for the angled saw cuts? 5) Are there any extra tools I can run to do some final checking? This is my first board and I'm afraid of doing something stupid. Maybe someone could take a quick look at it for something obvious? The public URL is https://easyeda.com/editor#id=CA6nFXR9r|oEMGARLFl|JBN964E0A|y81VP7pHB.