Hi all! I am drawing my first PCB for the use as a carrier board for a gas sensor. I work in gas sensor development. The gas sensor is a stack of heater, thermoelement and a metal oxide layer on top of a silicon substrate.
The silicon substrate onto which the metal oxide layer is deposited contains an electrode system. The electrodes are connected to bond pads. On the PCB I have drawn corresponding wire bond pads (solid areas)
which are connected to male header pins. My question is, what layer should i define the solid areas so that these areas are the top layer and can be used as wire bond pads?
If my description is not up to your standard, I am sorry and I will revise :-).
Thanks in advance!
Best regards
Robert
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