Hello I am sure I am doing something wrong, so apologies if this is just a misunderstanding. I am trying to create the surface mount pads for the processor here: file:///Users/mark/Downloads/FE310-G000-DS.pdf![FE310-G000-DS.pdf][1] If you look to page 21 you can see the dimensions of the pads. Step 1) Set config sizes So I set my grid size and snap size to 0.1mm ![Setting grid size][2] Step 2) Create the base large surface area Looking at the dimensions I can see it should be 4.2mm. ![Creating base area][3] Step 3) Create the first mount pad Looking at the spec I can see the pins should be 0.65mm x 0.2mm. So I create another pad. Now, as I'm starting with the top row, I can see form the docs that the bottom of the pad should be 0.4mm above the top of the base pad. ![Link to specifications for top row pad][4] However I can not get this to be the 0.4mm from the top. If I change the snap size to 0.01mm I can get it pretty close, but it's still about 0.005mm out. Maybe when designing PCB's you just don't need to be that precise, but it seems like when working with such a small chip it might make a big difference. ![enter image description here][5] ![enter image description here][6] So I tried to put the Center X from -2.85mm to -2.855mm but it's limited to 2 decimal places so just reverts. Thanks again for any help you guys can offer. [1]: /editor/20171122/5a149d8a0cccc.png [2]: https://i.imgur.com/vxX1wny.png [3]: https://i.imgur.com/1fttQph.png [4]: https://i.imgur.com/AYiSNaC.png [5]: https://i.imgur.com/smhyHfW.png [6]: https://i.imgur.com/ExqilzL.png