Hello, I am trying to create a thermal pad on the other side of the board below this footprint: QFN-28_L5.0-W5.0-P0.50-BL-EP The JLCPCB component with this footprint is a stepper motor controller: [https://lcsc.com/products/Motor-Drivers_611.html?q=tmc2209](https://lcsc.com/products/Motor-Drivers_611.html?q=tmc2209)<br> <br> I tried to generate an exposed copper area on the bottom layer underneath the footprint. Then I tried to use 'Add/Rmove Vias' to create an array of vias between the exposed die pad and the copper area on the bottom layer. Unfortunately, this does not seem to work. I can only generate vias when I make two copper areas, one on the top layer and one on the bottom layer. Then the vias appear properly. But between a 'pad' of a foot print and a copper area the 'Add/Rmove Vias' tool does not seem to work. What am I missing? Is there a work around? I thought of using a QFN footprint without the exposed die pad, and then creating a separate grounded copper area instead of the pad. But that seems a bit 'inelegant'..;-) Any input would be greatly appreciated! Thanks much in advance! Thanks!